As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration — stacking chips on top of each other. This vertically layered architecture could allow high-performance processors, like those used for artificial intelligence, to be packaged closely with other highly specialized chips for communication or imaging. But technologists everywhere face a major challenge: how to prevent these stacks from overheating.Now, MIT Lincoln Laboratory has developed a specialized chip to test and validate cooling solutions for packaged chip stacks. The chip dissipates extremely high power, mimicking…
